Imec opens new automotive chiplet site

Imec has opened its new office on the IPAI campus in Heilbronn to drive the development of chiplet-based architectures in the automotive industry. Luc Van den Hove, CEO of imec, emphasized the importance of the regional presence in supporting the automotive industry's transition to advanced chiplet technologies. The site will develop state-of-the-art chiplet designs and system integrations as part of the Automotive Chiplet Program (ACP). The site is also a key partner in the European CHASSIS project, which focuses on heterogeneous integration for high-performance computing in the automotive sector.

A memorandum of understanding with the Technical University of Munich is intended to promote the exchange of knowledge. The Automotive Chiplet Forum taking place at the same time in Heilbronn underlines the importance of international cooperation in the field of chiplet innovation.