PI has unveiled an expanded offering of automated alignment systems for silicon photonics (SiPh) chip assembly and packaging at Photonics West this week. These systems help customers increase productivity and throughput in photonics chips production.

Due to the increasingly demanding quality assurance steps and the increasing demand for silicon photonics components, PI offers new solutions with air bearing tables and a new entry system in addition to proven systems.

The global market for SiPh components is expected to increase to around ten billion US dollars by 2030. The precise alignment of photonic elements and structures on chips plays a crucial role. PI addresses this challenge with its award-winning technology for high-throughput industrial alignment of photonic components (fast multi-channel photonics alignment, FMPA) and special high-precision mechanics.

In addition to proven solutions with hexapods and piezoelectric nanopositioners, PI is presenting an alignment system with ultra-pure, highly dynamic compact air bearing linear stages for the first time. Another new system offers cost-effective functionality with long travel distances for less demanding applications.

For testing silicon photonics components on large-area substrates such as circuit boards, trays or special carriers, PI offers modular, scalable portal systems that can now also use advanced FMPA technologies.

The axes are controlled via controllers with predefined software, including expandable EtherCAT-based controllers from ACS, a PI Group company.