3D-Micromac systems for Infineon

The order was preceded by a joint-development project in which 3D-Micromac’s lasertrimming process was transferred into a mass-production-capable laser system. The basis for the new solution was the microVEGA system – a system that has already been utilized successfully to process up to 300-mm (12-inch) semiconductor wafers in several industrial use cases. 

The laser beam of the microVEGA FC is shaped in the single-digit micrometer range and moves continuously over semiconductor chips. During this motion, the laser selectively processes defined microstructures of several dies. This trimming process adjusts the resistance value in individual IC chips to a target value. The small size of the dies’ structures (approximately 1 – 2 µm) and the resulting extremely high demands on the threedimensional positioning accuracy of the laser spot in relation to the structures place the highest demands on the machine hardware. The microVEGA FC includes an integrated measuring technology to achieve 100-percent process control, overcoming a particular challenge in semiconductor laser-trimming applications. The microVEGA FC system features fully automatic handling for 200 and 300-mm wafers. At process speeds of up to 400 mm/s, the system achieves a positioning accuracy of ±200 nm (at 3 sigma).

Infineon plans to begin manufacturing analog/mixed-signal technologies and power semiconductors in Dresden's Smart Power Fab in the fall of 2026. The interaction of power semiconductors and analog/mixed-signal components enables particularly energy-efficient and intelligent system solutions commonly used in power supply systems, such as energyefficient chargers, smaller engine control units for cars, data centers, and Internet of Things (IoT) applications.

Further reading: Hans-Ulrich Zuehlke, Mandy Gebhardt (both: 3D-Micromac): Cost-Effective Production of Integrated Monolithic Sensor Packages – Selective laser annealing enables the setting of different reference magnetization directions on sensors, PhotonicsViews 18(2), April/May 2021, 32-35, first published: 14 April 2021; DOI:
10.1002/phvs.202100032