Next-gen photonic scanner-detector chip unveiled
The new samples will be available from Scantinel for customers in Q4 2024.
Light detection and ranging sensor technology specialist Scantinel Photonics reinforces its position in the high integration of photonic integrated circuits (PICs) field with the introduction of its next generation photonic single chip based on standard CMOS technology.


The next-generation PIC feature a fully integrated, massively parallel detector system for coherent lidar. The recently fabricated photonic chip, which includes both a scanner and detector system on a single chip, was successfully tested at Scantinel. It demonstrated a significant per-pixel improvement in signal-to-noise ratio of about 20 dB compared to previous solid-state lidar scanners.
This scanner-detector chip is a fully integrated, automotive-ready device that serves for automotive lidar Samples. The Sample includes a photonic chip and a low-noise electronics board. Due to the SNR (signal-to-noise ratio) improvements, the system has achieved a tenfold reduction in lidar power consumption, paving the way for faster pixel rates. Compared to market systems using proprietary technology or two-mirror scanners, this generation features a solid-state scanning and fully leverages the advantages of FMCW technology over existing time-of-flight (TOF) lidar systems.
The PIC production is fully transferred to high-volume standard CMOS fabrication, indicating the advanced maturity of the technology being developed.
“We believe in the efficient integration of proven technology building blocks using CMOS fabrication in combination with hybrid-packaging processes to enable highly reliable single-chip photonic lidar sensors for the automotive market. Additionally, Scantinel’s integrated FMCW laser technology showcases a 10 kHz linewidth and 10 dBm in-waveguide power, which are critical parameters for an integrated optical amplification system,” explained Vladimir Davydenko, chief scientist and co-founder of Scantinel.
Company
Scantinel Photonics GmbHSöflinger Str. 100
89077 Ulm
Germany
most read

Siemens takes over Canopus AI
This expansion of the Siemens EDA software portfolio is designed to help chip manufacturers improve precision and efficiency in wafer and mask inspection processes.

Global robot density: Western Europe leads ahead of North America and Asia
In the EU-27, the robot density is 231, which is above the global average of 132.

Sick increases sales in 2025
In the 2025 financial year, the company increased its turnover to 1.85 billion euros, an increase of 6.5% compared to the previous year.

5 robotics trends for 2026
The International Federation of Robotics reports on the five most important trends for the robotics industry in 2026.

"Solutions and Products for Defense" Technology Day Showcases the Latest Innovations for Mission-Critical Applications
The free online event is now available as a recording at no cost and is aimed at users and integrators in the field of machine vision.





