Light detection and ranging sensor technology specialist Scantinel Photonics reinforces its position in the high integration of photonic integrated circuits (PICs) field with the introduction of its next generation photonic single chip based on standard CMOS technology.

The next-generation PIC feature a fully integrated, massively parallel detector system for coherent lidar. The recently fabricated photonic chip, which includes both a scanner and detector system on a single chip, was successfully tested at Scantinel. It demonstrated a significant per-pixel improvement in signal-to-noise ratio of about 20 dB compared to previous solid-state lidar scanners.

This scanner-detector chip is a fully integrated, automotive-ready device that serves for automotive lidar Samples. The Sample includes a photonic chip and a low-noise electronics board. Due to the SNR (signal-to-noise ratio) improvements, the system has achieved a tenfold reduction in lidar power consumption, paving the way for faster pixel rates. Compared to market systems using proprietary technology or two-mirror scanners, this generation features a solid-state scanning and fully leverages the advantages of FMCW technology over existing time-of-flight (TOF) lidar systems.

The PIC production is fully transferred to high-volume standard CMOS fabrication, indicating the advanced maturity of the technology being developed.

“We believe in the efficient integration of proven technology building blocks using CMOS fabrication in combination with hybrid-packaging processes to enable highly reliable single-chip photonic lidar sensors for the automotive market. Additionally, Scantinel’s integrated FMCW laser technology showcases a 10 kHz linewidth and 10 dBm in-waveguide power, which are critical parameters for an integrated optical amplification system,” explained Vladimir Davydenko, chief scientist and co-founder of Scantinel.