XYZ positioning system for semiconductor inspection

The inspection system with traverse paths of up to 720 mm allows the simultaneous inspection of several 300 mm wafers or individual substrates measuring up to 700 x 700 mm at top speeds of up to 1,000 mm/s. Ironless direct drives make this high speed possible. Thanks to the repeat accuracy of 0.3 µm, precise measurement results and enormous increases in quality can be achieved. The Z-axis was designed for sensors and camera systems up to 5 kg. The vertical adjustment can be either fixed, manual, motorized with a spindle or dynamic with a pneumatically balanced direct drive for height compensation with fully interpolated movement. The test piece support can also be adapted to the specific application. You can choose between a ground plate, a plate with a drill pattern and a chuck.