Higher Scanning Speed

At the Technology Forum on 11 and 12 February 2009, Viscom will present its successful QuickScan solder paste inspection on a new system platform, the S3088-II QS. The proven special illumination has been integrated into the system S3088- II, along with a new camera technology. Until now, the S3088-II has been offered as a post-reflow AOI with 8M camera technology. Now Viscom exploits the advantages of this system platform for 2-D solder paste inspection as well. The integration of a new camera head especially for paste inspection and a new high resolution line scan camera results in a scanning speed increase of up to 50 %. This combination yields cycle times even lower than those achieved by the predecessor model. Customers who already employ a S3088-II post-reflow also profit from synergistic effects during service and maintenance.