The on-chip processing warp (Widely Advanced Rapid Profiling) used in it enables high speeds even at a high resolution. It detects the laser line and compresses it losslessly using algorithms. As a result, the sensor creates an unprecedented 3D profile pixel rate of, for example, 128 megapixels at an ROI of 200 lines with a profile speed of 42 kHz.

In order to achieve the highest possible profile rates, Region of Interests (ROI) are first defined within the sensor. In addition, a so-called region tracking is available for higher reliability. This has the advantage that the ROI is also optimally positioned around the laser line for components that move during the measurement process. 3D algorithms also automatically ensure precise extraction of the height information of the scanned object.