Zeiss Microscopy opens Semiconductor Applications Lab
State-of-the-art innovation laboratory in Dresden, Germany, pushes the limits of advanced semiconductor applications.
Zeiss has recently opened its Microscopy semiconductor applications lab in Dresden, a state-of-the-art facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).


The new facility is strategically located in Dresden, the heart of semiconductor innovation within Europe, allowing for close collaboration with semiconductor industry customers and partners on physical failure analysis, materials development and process yield improvement for advanced logic and memory, power semiconductors, MEMS, advanced packaging, and more. The company will address increased automation of microscopy workflows and advanced techniques to help the semiconductor industry accelerate root cause analysis and pathfinding for the most challenging issues in microelectronics.
This laboratory in Dresden is the third major investment of Zeiss into semiconductor microscopy applications and strengthens the company’s global support capabilities. The Dresden team collaborates closely with its counterparts in Taiwan and Korea to share knowledge and best practices to best address customer needs across these three global hotspots of semiconductor excellence. Importantly, the advanced applications developed by these three teams will steer the innovation roadmap to meet the greatest challenges facing lab professionals in the semiconductor industry.
The semiconductor microscopy applications lab is located within the Innovation Hub Dresden that opened last May. The site complements Zeiss’ Innovation Center in Hsinchu Science Park, Taiwan, which opened in June 2024 and features a comprehensive portfolio to meet the productivity needs of semiconductor research and development, production and failure analysis. The third Innovation Center is in Dongtan, Korea, where the company develops applications across a complete portfolio of optical and electronic equipment, X-ray microscopy and high-resolution CT, and 3D metrology instruments.
Further reading: Zeiss expands its Innovation Hub in Dresden, wileyindustrynews.com, 17 May 2024 • Werner von Siemens Ring goes to Zeiss and Trumpf, wileyindustrynews.com, 18 September 2024
Company
Carl Zeiss AGCarl-Zeiss-Str. 22
73447 Oberkochen
Germany
most read

Zeiss Strengthens Its Semiconductor Business with a New Semiconductor Innovation Center in Korea
The center brings together systems from the Semiconductor Fab Solutions and Semiconductor Mask Solutions divisions and serves high-volume wafer production, wafer-level packaging, and photomask manufacturing.

Market for humanoid robots set to grow to 15 billion dollars by 2035
According to the report "Humanoid Robots - 2026" by Interact Analysis, the market for humanoid robots is still at an early stage, but shows significant growth potential for the 2030s.

Global Robotics Associations Call for a Joint Automation Strategy
Four international robotics and automation associations have signed the Barcelona Declaration on Robotics and Automation 2026.

Keysight Acquires VPIphotonics
Developers in the fields of optics and electrical engineering can use it to model photonic components, circuits, and complete transmission links in a unified environment.

Global robot density: Western Europe leads ahead of North America and Asia
In the EU-27, the robot density is 231, which is above the global average of 132.






