Obtaining a three-dimensional ­image of the interior of a component quickly is possible with an enhanced software package from a CT manufacturer. The image quality also increases significantly. This makes 3D computed tomography an efficient, fast inspection method.

X-ray technology has established itself as the optimal inspection method in many areas of industry. In particular three-dimensional computed tomography, which provides a detailed, spatial image of the interior of the test part, is experiencing growing demand. Due to increasingly complex components in which functional structures overlap, two-dimensional radio­scopy is not sufficient anymore. However, conventional computed tomography, in which the test part is scanned from many angles in a 360° circular scan, is relatively time-consuming and costly, and in particular the scans of flat components suffer from losses in detail detectability. Comet Yxlon has packaged optimized X-ray methods that deliver up to ten times higher detail recognition and up to five times higher throughput for just these components.

Optimized Processes in the Semiconductor Industry

For some years now, especially the inspection of integrated circuits in the semiconductor industry and of batteries as the basis for electromobility has been gaining importance. It is not only a question of safety and functionality as well as the optimization of production processes with the help of the extensive CT data but just as much a question of efficiency and productivity in development and production.

In the case of microchips, it is primarily a matter of inspecting the electrical connections, be they wire bonding, solder balls (BGA), or silicon vias (TSV).

Even the solder balls (bumps) have several typical defects that can affect the function of the electronic component.
A prismatic or pouch cell is mainly inspected for cathode and electrode overhangs, deformations, foreign body inclusions, welds, and defects such as fractures and cracks, which is even possible with X-ray technology after the cells are installed in modules and the modules in packs. Defects in a battery cannot lead to performance degradation or shortened life only, but in the worst-case scenario, they may cause a fire due to a short circuit. Therefore, detailed and reliable testing of batteries before they are used is essential. In addition, the extensive CT data can ­identify trends that provide conclusions about the production process and allow direct intervention and correction to optimize it.

New Software Packages for Impressive Inspection Results

Specifically for use with its FF series high-resolution CT systems, Comet Yxlon has developed software packages that offer users fantastic inspection results at maximum speed and efficiency – integrated and easy to use via the intuitive Geminy software platform.

The basic Vista package includes the proven Quickscan mode for an initial overview of the test part and Qualityscan for high-resolution depth analysis. Flexcenter as a virtual rotation axis means great time saving when the ROI (Region of Interest), the area which needs to be looked at again in particular, is not in the center of the rotary table. The system calculates the required movements so that the ROI is in the center of the result without the user having to reposition the test part.

However, for chips and batteries, as previously described, the aspect ratios are 1:5 to 1:20, and the required information is located behind the large areas of the component. The customary circular scan spends the same amount of care and time on each angle, i.e., just as many shots are taken on the narrow sides with great depth as on the informative wide sides with shallow depth. With the help of the new Speedmode in the Vista package, the user can define on which sides fewer projections are required for a meaningful result, thus speeding up the scanning process by up to three times. The examples shown here are scan results of a smartphone.

In the usual circular scan, the test part‘s widest side determines the minimum distance of the component to the X-ray components. This defines the diameter of the inspection volume and, in approximation, coincidently, the detail detectability. This is usually unfavorable for the application because the flat side could well achieve a higher magnification in the system and, thus, higher detail detectability. In addition to the Vista features described above, the Vista-X-package includes the patented ZoomScan, which takes advantage of the SmartGuard available as standard in the high-resolution Comet Yxlon CT systems.

Defining Exact Dimensions

Originally developed as a tool for intelligent crash protection when positioning inspection parts, SmartGuard is used to define the exact dimensions of the inspection part. During subsequent scanning with ZoomScan, the system follows the concrete outline of the test part and achieves up to ten times the resolution of a simple circular scan. If Speedmode is activated too, the highest resolution is achieved at maximum speed.

The Vista-X-Pro-package additionally offers the Layerscan feature for optimum productivity. Layerscan is a patent-pending Comet Yxlon computed laminography solution. This efficient technology can produce high-resolution layer images of flat parts without requiring 360° rotation of the test part. This results in up to five times faster scanning speed while providing higher detail detectability. For some applications, it is disadvantageous that the resolution is lower in the beam direction. However, the typical artifacts that occur when radiating through the long edges in the usual circular scan are reduced, resulting in significantly more homogeneous layers in the image.

Increased Performance for X-ray Inspection

Overall, users who inspect flat and complex components such as batteries or electronic components experience a significant increase in performance for X-ray inspection with the Comet Yxlon Vista-X-packages, scalable to their requirements. The sophisticated software features, intelligently used and combined, ensure the best image quality with the shortest scan times and, thus, the highest possible efficiency of the inspection process. So, thanks to continuous further developments, a high-priced inspection technology such as computed tomography can help developers and producers achieve maximum throughput and minimum scrap and ‘open up new horizons’.

Authors
Jan Tamm,  Senior Product Manager Comet Yxlon
Gina Naujokat, Marketing Communication Manager Comet Yxlon