Teledyne Dalsa and Wickon Hightech cooperate
The two companies have announced a strategic collaboration to jointly develop 3D scanning technology.
This partnership combines Teledyne Dalsa's expertise in high-resolution image sensors with Wickon Hightech's innovative 3D inspection and measurement systems. The goal is to set new standards in precision, speed and reliability. The technology integration uses advanced image sensors and 3D technology for high measurement accuracy. The performance increase enables faster and more accurate inspections in industries such as semiconductors, batteries, precision manufacturing and healthcare.
The global reach expands market presence by combining the strengths of both companies. Both companies are committed to excellence and share a common vision to push technological boundaries. Keith Reuben, President of Teledyne Vision Solutions, and Roman Wieser, CEO of Wickon Hightech, emphasize the importance of this partnership in developing groundbreaking solutions that meet the increasing demands of customers. The collaboration is intended to advance the next generation of 3D scanning technologies and provide the industry with more efficient and precise tools.
