STMicroelectronics has unveiled its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters. With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply, and the interconnections linking them. ST is helping hyperscalers, and the leading optical module provider, overcome those challenges with new silicon photonics (SiPho) and next-gen bipolar complementary metal-oxide-semiconductor (BiCMOS) technologies.

At the heart of interconnections in a datacenter are thousands, or even hundreds of thousands, of optical transceivers. These devices convert optical into electrical signals and vice versa to allow data flow between graphics processing unit (GPU) computing resources, switches and storage. Inside these transceivers, ST’s new, proprietary silicon photonics technology will bring customers the ability to integrate multiple complex components into one single chip, while ST’s next-gen, proprietary BiCMOS technology brings ultrahigh-speed and low power optical connectivity, which are key to sustain the AI growth.
 
“The pluggable optics for data center market is experiencing significant growth, valued at 7 billion dollars in 2024,” said Dr Vladimir Kozlov, CEO and chief analyst at LightCounting. “This market is expected to grow at a compound annual growth rate  of 23 % during 2025 – 2030 to exceed 24 billion dollars at the end of this period. Market share of transceivers based on silicon photonics modulators will increase from 30 % in 2024 to 60 % by 2030.”

ST’s SiPho technology combined with the ST BiCMOS technology are a unique 300 mm silicon platform to serve the optical market. Both technologies are being industrialized and will be manufactured in ST’s Crolles, France, 300-mm fab.