Siemens and Foxconn work together
Both companies sign a letter of intent that underlines their shared commitment to greater sustainability.
Young Liu, Chairman and CEO of Hon Hai Technology Group (Foxconn) and Cedrik Neike, CEO of Digital Industries and Member of the Board of Management of Siemens AG sign a letter of intent. Image: Siemens
Siemens and Hon Hai Technology Group (Foxconn) have signed a memorandum of understanding to advance digital transformation and sustainability in intelligent manufacturing platforms.
The collaboration focuses on global manufacturing processes in the areas of electronics, information and communications technology and electric vehicles (EV). Siemens and Foxconn want to work together to build a scalable and seamless engineering and manufacturing ecosystem.
