Using glass substrates for advanced packaging and heterogeneous integration represents a major shift in the current semiconductor market and one of the biggest challenges chip manufacturers face today. Industry leaders have already announced timelines for the large-scale introduction of glass core substrates and glass-based interposer.

To meet these ambitious targets, LPKF has initiated a cooperation program to build a robust glass-focused supply chain by the end of 2024. By collaborating with partners specialized within each step in the supply chain and end users, LPKF is ready to deliver next-generation glass substrates that satisfy the demands of artificial intelligence (AI) and support the growth of data centers.

LPKF assists customers in adopting glass core technology for advanced packaging applications either by integrating its LIDE technology (laser-induced deep etching) into the manufacturing process or by offering small to high volume manufacturing of glass cores through its Vitrion foundry. To accelerate large-scale production, the semiconductor industry needs a reliable supply chain with expertise in every step of glass processing and an imperceptible process integration into the individual ecosystem. 

“Glass is currently the most exciting material in the semiconductor market. However, scaling up glass-based packaging production goes far beyond the challenges of crack-free through glass vias,” says Dr Klaus Fiedler, CEO of LPKF. “We are ready to lead the way in this important transition period and, together with strong partners, we ensure seamless process integration for advanced packaging around the world.”