3D vision is increasingly used in conjunction with machine learning in many application areas. The latest COM-HPC modules not only offer these applications significantly...

Corning has launched a dicing technology that will allow the company’s laser technologies business to enter the semiconductor application space to further focus on...

As a leading component manufacturer, Hamamatsu is well aware of the advantages and disadvantages offered by various systems, and the main differences will be explained in...

In order to give developers of microlens arrays (MLAs) the opportunity to sound-out the potential of this technology, Ingeneric presents an MLA demonstrator in a new...

In October, Zwick invited Roell to the testXpo again - and held a press conference as part of the in-house exhibition. Among other things, the new testing machine...

A new manufacturing cell that includes milling, loading, and unloading, plus clamping technology and sensors for improved reliability facilitates the production of worm...

An industrial wafer baking machine is complex in terms of control technology. The ignition process of the gas-fired long-tube burner alone comprises 20 individual steps...

Large batches are increasingly being replaced by short runs – and this also applies to labels. To keep changeover times and waste low, the Danish press manufacturer...