The device has the pulser capacity and the ability to drive up to 64 probe elements simultaneously, increasing the data acquisition speed for TFM (Total Focusing Method) imaging. These expanded capacities can be used to expand and diversify the application portfolio.

It can process TFM images 4x as fast as its predecessor and comes in the same rugged case. Thanks to the large onboard memory of 1 TB, inspectors can also work longer on site and carry out more extensive inspection jobs without transferring data.

To facilitate inspection of complex and thicker test parts or welding applications, the instrument's full 64-element aperture with PA and 128-element aperture with TFM allows optimization of advanced Dual Linear Array (DLA) and Dual Matrix Array (DMA) sensors . To save time on setup, all models in the OmniScan X3 series have built-in DLA and DMA support.