The integrated charge-domain CMOS TDI sensor with 16k x (64+128+64) TDI arrays and a 5x5 µm pixel size uses advanced wafer-level coated dichroic filters with minimal spectral crosstalk to spectrally isolate the three images. The camera also features a high-speed CLHS interface that delivers up to 8.4 gigapixels per second over a single, long fiber optic cable.

The Linea HS 16k Multifield Camera greatly improves inspection speed and image quality. It eliminates the need to capture multiple images, increasing the throughput of inspection systems and improving defect detection by minimizing the impact of mechanical vibration. The Linea HS is ideal for applications such as flat panel display, printed circuit board (PCB) and semiconductor wafer inspection; web inspection of paper, film, metal foil and textiles, and for general machine vision and scientific applications.

The camera can also be used to capture color images with a white light source. The spectral properties of dichroic filters offer a unique color representation that can be used for improved defect detection.