Anyone looking for innovations in the production of industrial packaging should take a close look at Münsterland. Most recently, FH Münster and EMPAC from Emsdetten had developed a new process with which complex multilayer films can be produced directly dissipative. A laser shoots fine, but hundreds of small holes in the top film layers. This novel process will replace the expensive hot-pin perforation in the future. But: In order to ensure the Ableitfähigkeit of the films to 100 percent, actually every single hole should be checked. This is not the case with the previous test method; Here only foil samples come on the laboratory table. "You have to measure the resistance with a test voltage, to lubricate film samples with ultrasound gel," explains Sascha Wagner, engineer at the Laser Center of the FH Münster. "It's a destructive process that can not be done during the manufacturing process."

This is exactly where Wagner, the scientific employee Jan-Philipp Wessels and the Bocholt-based company thinkworks with managing director Helmut Teiting and his colleague Dennis Pollmann come in. In a ZIM project, they want to develop a novel, optical process that non-contact and non-destructive conductance of the microbores in the monitored ongoing production process. "For the first time, 100% control over the slides is possible," says Teiting. And this could be a basis for a certificate for conductive big bags, which are safe - according to the motto: guaranteed dust explosion-free.

The project has just been started, currently everyone is planning the next project steps. Wagner and Wessels perform material analyzes and spectroscopic analyzes with different light sources in the laboratory. As an expert in winding technology and sensors, Thinkworks takes over the electronics and software part. "Together we want to build a test stand and run experiments in the lab - integrate different optics to capture signals and data and also think about how we process them best," explains Wagner.